Backend area

In this area, the cutting and packaging of the wafers are carried out.

Equipment available in the backend area

  • K&S 961 MOUNTER FILM: Used to fix the wafer on its frame.
  • DAD 321 Disco Automatic Dicing saw: to cut the wafer.
  • Pic and place: Take the wafer chip and stick it on the package.
  • 4124 KS Ball Bonder: It is used to make connections between the chip and the package.
  • Oven and UV lamp.