Backend area In this area, the cutting and packaging of the wafers are carried out. Equipment available in the backend area K&S 961 MOUNTER FILM: Used to fix the wafer on its frame. DAD 321 Disco Automatic Dicing saw: to cut the wafer. Pic and place: Take the wafer chip and stick it on the package. 4124 KS Ball Bonder: It is used to make connections between the chip and the package. Oven and UV lamp.