Training on CVD Depot and Diffusion

The objective of this training is to give the user the opportunity to familiarize himself with the cleanroom environment, to understand the architecture and operation of equipment (diffusion furnace) and to understand the manufacturing process in microelectronics.

Training program:

1. Theoretical training:

  •  Theoretical course and basic notions on deposition techniques (atmospheric and vacuum) and equipment used (horizontal furnaces)
  •  Methodology for using diffusion furnaces (safety measures, HSE)
  •  Examples of recipes used for the broadcasting area

Duration: 2 hours.

2. Practical training:

An introduction to health and safety (HSE) practices in the area will precede practical training. This will include handling operations for deferential processes on cleanroom furnaces such as :

  • High-temperature diffusion up to 1200 °C
  • Annealing at medium and high temperatures from 100°C to 1200°C
  • Low-pressure chemical vapor deposition (LPCVD)
  • Silicon oxide deposition
  • Poly-Silicon Deposition
  • Deposition of silicon nitride SiN
  • Dry oxidation with controllable oxygen flow
  • Wet oxidation with controllable oxygen and hydrogen flows

Duration: Half-day