[vc_row][vc_column][vc_column_text]<\/p>\n
The equipment in the wet etching and cleaning area is divided into spin and bath equipment:<\/p>\n
This equipment is intended for etching silicon oxide with hydrofluoric acid (HF) solution buffered by ammonium fluoride (NH4F), known as BOE (Buffered Oxide Etch). The chemical solution is loaded manually.
\nIt is made of natural polypropylene, the piping of Polyvinylidene fluoride (PVDF), which has good acid resistance.<\/p>\n
Silicon nitride etching equipment<\/span><\/p>\n This equipment is intended for etching silicon nitride (Si3N4), with 80% phosphoric acid solution (H3PO4) at 160-165\u00b0C. The chemical solution is loaded manually. It is manual loading equipment designed for the use of flammable solvents for the removal of photosensitive resins, etching of polymers, polyamides and organic contaminants. It is designed for cleaning, stripping & etching processes:<\/p>\n This equipment is dedicated to the final rinsing and drying of wafers after any process has been carried out. The chemicals used are:<\/p>\n In the case of baths such as etching oxide and silicon nitride, PPE is mandatory, given the direct contact with the chemical solution, and is the apron, glasses, mask and chemical-resistant gloves.[\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column][vc_gallery interval=”3″ images=”7662,7676,7667,7670,7673″][\/vc_column][\/vc_row]<\/p>\n","protected":false},"excerpt":{"rendered":" [vc_row][vc_column][vc_column_text] Wet etching and cleaning area The equipment in the wet etching and cleaning area is divided into spin and bath equipment: Silicon oxide etching equipment This equipment is intended for etching silicon oxide with hydrofluoric acid (HF) solution buffered by ammonium fluoride (NH4F), known as BOE (Buffered Oxide Etch). The chemical solution is loaded […]<\/p>\n","protected":false},"author":46,"featured_media":2448,"parent":7694,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"division-page.php","meta":{"footnotes":""},"class_list":["post-7713","page","type-page","status-publish","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/pages\/7713\/"}],"collection":[{"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/pages\/"}],"about":[{"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/types\/page\/"}],"author":[{"embeddable":true,"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/users\/46\/"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/comments\/?post=7713"}],"version-history":[{"count":0,"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/pages\/7713\/revisions\/"}],"up":[{"embeddable":true,"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/pages\/7694\/"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/media\/2448\/"}],"wp:attachment":[{"href":"https:\/\/www.cdta.dz\/en\/wp-json\/wp\/v2\/media\/?parent=7713"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
\nThe general design of this equipment is almost similar to that for silicon oxide etching.
\nIt is made of natural polypropylene, the piping of Polyvinylidene fluoride (PVDF), which has good acid resistance.<\/p>\nSPRAY SOLVENT TOOL (SST)<\/span><\/h2>\n
\nIt is made of stainless steel, a material resistant to the attack of organic solvents.<\/p>\nSPRAY ACID TOOL (SAT)<\/span><\/h2>\n
\n
Spin Rinser Dryer (SRD)<\/span><\/h2>\n
\nRinsing the wafers with ultra pure water and drying with hot nitrogen which evaporates the water and moisture from the surface.<\/p>\nThe chemicals used<\/span><\/h2>\n
\n
\nH2O2 at 60\u00b0C, and 90\u00b0C no direct contact<\/li>\nPersonal protective equipment <\/span><\/h2>\n