Printed Circuit Prototyping Section

The mission of the printed circuit board prototyping section is to produce electronic board prototypes with the following phases of production:

• Engraving of cards (single-sided, double-sided and multilayer with a maximum of eight (08) layers)
• Hole Metallization (VIAs)
• Varnishing of the cards
• Screen printing on printed circuits
• Installation and welding of components (SMD or through holes)

Our equipment:

• Protomat S63
  • Etching of PCB chips
  • Etching of welding and screen printing stencils
  • Piercing of inserts
  • Cutting of the inserts

• MultiPress S
  • Assembly of multilayer circuits

• ProtoFlow S
  • soft brazing oven by refusions

• ProtoPlace S
  • Semi-automatic component placement system

• LPKF ProtoPrint S
  • Carrying out screen printing operations on electronic boards

• LPKF Contac S4
  • Hole Metallization (VIAs)

Drawing rules for printed circuits

In order to be able to successfully produce your electronic boards, the rules indicated below must be respected when designing the boards.