Process Section

The process unit’s mission is to develop and ensure the production steps of the 1µm CMOS license and MEMS components, more precisely, the following steps:

  • The realization of physical and chemical deposition processes
  • Wet etching and chemical cleaning
  • Dry plasma etching
  • The realization of lithography process
  • Ion implantation
  • Inspection and characterization of the implementation steps
  • Cutting and encapsulation of electronic chips

List of equipments set up for the realization and characterization:

  • Photolithography (I-line UV stepper 6″+Dual Coater & Developer Track).
  • Wet etching and cleaning (SAT, SST, etc.).
  • Dry plasma etching (Metal, PolySi, Oxide, Nitride).
  • Ionic implantation in Phosphorus (doping N), Boron (doping P) and Arsenic (doping N).
  • Diffusion and deposition (Silica, nitride, poly, oxidation) with horizontal furnaces intended for the realization of processes at atmospheric pressure and low pressure.
  • Metal Deposition PVD (Aluminium, titanium, TiN).
  • Thin films deposition of PECVD  (oxide & nitride).
  • Metrology, Inspection & Testing.
  • Cutting & encapsulation.

Photolithography area

All the steps of the photolithographic process (dehydration and HMDS deposition, resin deposition and spreading, UV exposure, resin development, and inspection…) are carried out in this area…

Diffusion area

The diffusion area includes three horizontal ovens for atmospheric pressure and low-pressure processes such as oxidation, diffusion, annealing, silicon nitride deposition, poly-Si deposition and TEOS and BPSG deposition…

Plasma deposition area

The purpose of the plasma deposition area in the CMOS technological fabrication process is to make contacts and interconnections (metal layers) between the different parts of the circuit in-process, as well as to make the following…

Plasma etching area

Dry plasma etching uses gas phase etching agents in a low-pressure plasma. It allows directional etching without using the crystal orientation of the substrate or the layer to be etched.

Ion implantation area

A medium-current ionic implanter is used to introduce dopants into a platelet.

Wet etching and cleaning area

The equipment in the wet etching and cleaning area is divided into spin and bath equipment…

Characterization area

The characterization equipment is used for non-destructive testing during fabrication or for advanced process characterization, the plant has a wide range of characterization equipment. Our many characterization tools allow us to…

Backend area

In this area, the cutting and packaging of the wafers are carried out.