Training courses and services in clean room

The development, testing and production of electronic components require know-how and expertise that the Micro Fabrication Technology Platform (MTP) wishes to make available to its customers. The PTM is a joint research service that pools micro-fabrication resources at the national level and carries out activities to produce integrated circuits, microsystems and sensors. Indeed, the platform offers a wide range of services and also participates in the deployment of VLSI tools to universities in order to promote microelectronics training at the national level by setting up an ecosystem in this discipline.

Our knowledge and our clean room allow you to carry out projects based on a few steps to the realization of a complete circuit in CMOS 1-µm technology including cutting and assembly. Get an idea of the expertise of our platform by consulting the list of quality services under a clean room environment controlled in temperature, humidity and pressure.

Training on Microelectronic Processes

This training provides a comprehensive theoretical and practical approach to the fundamental operations of fabrication silicon integrated circuits.

Training on Thin Film Deposition by PVD and PECVD

The objective of the training is to acquire basic notions (theoretical and practical) on the two vacuum deposition techniques, PVD “Sputtering” and PECVD.

Training in Wet Etching and Cleaning

Training on wet benches is intended for all chemical users so that they are familiar with the good practice used in laboratories.

Training on CVD Depots and Diffusion

The objective of this training is to give the user the opportunity to familiarize himself with the clean room environment, to understand the architecture and operation of an equipment (diffusion furnace) and to understand the fabrication process in microelectronics.

Cleanroom Health and Safety Training

The objective of this training is to demonstrate good fabrication practices in a controlled atmosphere area, identify sources of contamination, etc.

Photolithography training

Theoretical training on photolithography is provided by engineers and researchers from the Microfabrication Technology Platform (PTM). It includes the different lithographic steps such as substrate preparation, deposition, …

Dry Etching Training

The PTM offers training on dry etching tools that includes familiarization with dry etching as well as the operation of equipment in the cleanroom. The training is intended for all users who intend to perform any type of dry plasma etching in the cleanroom.

Training on doping by Ionic Implantation

This course provides an overview and familiarization with the technique of doping semiconductors by ion implantation.  It is intended for engineers, technicians and students involved in the semiconductor industry who wish to acquire the basic concepts of microelectronics.

1. General information :

The maintenance and industrial safety section of the micro-manufacturing technological platform has developed a complete programme for training in the installation, maintenance and diagnosis of clean room utilities equipment for the socio-economic sector and students.

This on-the-job training will consist of two parts:

  • Theoretical component (Maximum 40% of the duration of the training) which will include the fundamental principles that govern the operation of the different types of systems and equipment.
  • Practical component (Minimum 60% of the duration of the training) which will include simulation work on the installed equipment in order to give them the necessary capacities to perform:
  • Troubleshooting.
  • Preventive maintenance.

2. GOALS :

The training aims to transfer to the participants the know-how required to carry out their needs according to:

  • The standards in force.
  • The rules of personal and collective health and safety in the workplace.


  • Cleanroom Technicians and Maintenance Engineers.
  • Mechanical systems technicians and maintenance engineers.
  • Technicians and engineers in the maintenance of environmental and safety systems.
  • Electrical system technicians and maintenance engineers.

A maximum of 4 to 5 people will be admitted per group and the price will be 20 000 DA/Person.

A group will be formed for each specialty.

Clean Room

  • Filtration System (CTA).
  • Filter ventilation unit system (FFU).
  • Air quality.
  • Protocol of a Clean Room.

Duration: 03 Days

Mechanical system

  • Recirculated air.
  • Fresh air.
  • Exhaust air.
  • Air quality.
  • Boilers.
  • Process vacuuming.

Duration: 03 Days

Environmental and safety system

  • Different Cylinders and type of gas.
  • Chemical products.
  • Chemical vapour neutralisation system.

Duration: 03 Days

Electrical system

  • Electrical distribution.
  • Main low voltage distribution panels.
  • Electrical distribution of a clean room.
  • Electrical safety of equipment in clean rooms.

Duration: 03 Days

List of clean room services.

Prices will be established on estimate.


Area Operations/services


(Classe 10)

Resin coating
Resin development


(Classe 100)



(Classe 100)

Aluminium Deposition (Al)
Titanium Depot (Ti)
Titanium nitride deposition (TiN)


(Classe 100)

depot(PECVD) silicon oxide (SiOx )
depot(PECVD) silicon nitride(SiNx)
RIE etching of silicon oxide (SiO2, SiOx)
RIE etching of silicon nitride (SiN, SiNx)
RIE etching of poly-silicon (Poly-Si)
RIE engraving of metals
Dissolution Plasma resin RIE


(Classe 100)

Implantation (As, B, P)

(Classe 100)

Wet oxidation (SiO2-CVD)
Dry oxidation ( SiO2-CVD)
Depot of silicon oxide (LPCVD)
Depot of BPSG (LPCVD)
Depot (LPCVD)  silicon nitride(Si3N4)
Depot(LPCVD)   poly-silicium (Poly-Si)
Doping type N by phosphorus diffusion (P)
Annealing / redistribution


(Classe 100)

Cleaning RCA
Cleaning Piranah
Cleaning EKC
Cleaning wet (BOE 1:30) silicon oxide
Wet etching (BOE 1:15) silicon oxide
Wet etching of silicon nitride (SiN, SiNx)
BACKEND Wafer cutting
Encapsulation and interconnection (ball bounding)

Drawing rules for printed circuits

In order to be able to successfully produce your electronic boards, the rules indicated below must be respected when designing the boards.

Dr. A. Slimane