The division is organized into four research teams: TDCSD Team: Tools, Digital Circuits and Systems Design team Analog / RFIC team: Analog / Radio Frequency Integrated Circuits team FCS Team: Reliability of Semiconductor Components team MEMS & SENSORS team: Micro-Electro-Mechanical Systems and Sensors team These teams operate three platforms, namely the Electrical Characterization platform, the Design Tools Platform, and the MEMS platform. The organization chart of the division is represented by the following figure.
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